Flexus (Tencor FLX2320) is a thinfilm stress measurement instrument. It accurately measures the changes in the radius of curvature of the substrate caused by the deposition of a stressed thin film on the substrate. Flexus can also measure the Elastic constant and thermal expansion coefficient of a Operational Procedures for the Thin Film Stress Instrument Emma Dietholm Thin Films April 13, 2004 The FLX2320 is a thin film stress machine. A laser scanner is used to measure the changes in found in section 93 of the User Manual.
2. 3 Measurements The FLX2320 measures the deflection (bowing) of a wafer using a laser beam. The laser KLATencor FleXus FLX 2320. Description: Thinfilm stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film.
Features: Laser scanning to measure stress on all reflecting films. You are here: Home Equipment Characterization& Testing Summary Flexus 2320 Flexus 2320 Stress Gage, stresstest Navigation Equipment Marvell NanoLab Member login Lab Manual Contents MercuryWeb Berkeley Microlab Chapter 8.
52 Flexus Thin Film Stress Measurement (flexus 380) 1. 0 T i t le Flexus Thin Film Stress Measurement 2. 0 Purpose Flexus (Tencor FLX2320) is a thinfilm stress measurement instrument. Toho Technology FLX 2320S Temperature measurements are essential for characterizing material properties such as stress relaxation, moisture evolution, and phase changes.
The FLX2320S is a thinfilm stress measurement instrument. It calculates film stress by measuring the change in radius of curvature of a substrate caused by the deposition of a thin film on the substrate. FLX Flexus thin film stress measurement systems. FLX2320 for sample sizes 25 mm 200 mm and FLX3300 for sample sizes up to 300 mm.
Specifications Read more Read less. Maximum Scan DiameterSample Size. Using the manual or the automated rotation option (only available for the FlexusR version), the sample is rotated multiple times KLATENCOR FLX2320 FILM STRESS MEASUREMENT SYSTEM consisting of: Model: FLX2320 (Flexus 2320) Manual Wafer Load Thin Film Stress Measurement System Chuc This is a for sale ad about Tencor Flexus FLX 2320 Thin Film Stress System.
Its condition is used, second hand, surplus, or refurbished. EquipMatching Ad The complete manual is available. PreCheck. Turn. ON. MAIN switch of instrument located right on top panel. enter the FLEXUS software. Click on. USER 1. To check laser intensities: Under. UTILITIES. in main menu choose. PC PORTS DIAGNOSTICS TENCOR FLX2320 The FLX2320S determines stress by measuring the curvature change of pre and postdeposition of the film.
This difference in curvature is used to calculate stress by way of Stoneys equation, which relates the biaxial modulus of the substrate, thickness of the film and substrate, and the radius of curvatures of pre and postprocess. Flexus 2320 Film Stress Measurement System. Model: The FLX2320 chuck can be suppled with Room Temp Chuck or with Optional HOT Chuck for stress monitoring at high temperature temperatures, and an optional cooling unit that allow a thorough understanding of film properties at temperatures from Up to 500C.
An inert flush capability offers a